Co-hosted by the CPMT Society of IEEE & the SEMI Americas Advanced Packaging Committee
Over the last few years, system and package engineers have been using the power of new packaging and assembly technologies to build in high performance and optimized form-factors for a slew of new products - from high-performance IoT and wearables, to blazing game processors, AI & VR products, autonomous vehicles, new function-oriented data-centers and networks. This session will explore the technology innovations that enable some of the leading applications, including SiP, embedding, integrated photonics, 2.5D & 3D packaging. We will also take an in-depth look at what are the upcoming challenges in heterogeneous integration and how closer collaboration and co-design can benefit the whole value chain.
The afternoon seesion: Advanced Packaging Technologies Enabling Advanced Applications follows at 2:00pm
- Li Li, Ph.D, Distinguished Engineer, Cisco Systems
- Hem Takiar, Vice President Packaging/Assembly Engineering Western Digital Corporation