Tim Lee

Technical Fellow

Timothy Lee, currently a Boeing Technical Fellow, is responsible for the development of RF and digital electronics for advanced communications networks and sensor systems at The Boeing Company (1998-Present). He is leading the development of state-of-the-art CMOS and RF integrated circuits and devices. Current interests include techniques to overcome the End of Moore's Law which includes 2.5D/3D heterogeneous integration and hardware designs for 5G millimeter-wave systems.

In the IEEE, Tim has served as the 2015 MTT-S President. In 2017 is serving as the Co-Chair of the IEEE 5G Initiative and also as the IEEE 5G mm-wave Roadmap Working Group Chair and also as the Chair of the IEEE 3I Adhoc Committee on Internet Inclusion.  Tim is working to grow a new generation of technical leaders whose vision is a thriving local community enabled by Internet and wireless technology. Tim believes that the only true way forward to invest not only in technology infrastructure but to invest in human capital to foster innovation and interactions between communities and technologists.

Share page with AddThis