Session 1.1 - Packaging and Test: New Packaging SiP Trend and Testing Challenges

Moscone North Room 21 Wednesday, July 10
10:50am to 11:15am

The Internet of Things (IoT) technology market is expected to be a new growth engine around the world in spite of the saturation of the mobile chip market.  
The IoT application market has been expanded to include a wide range of devices, which for wearable devices, automobiles, and home automation, and the need for quality assurance of embedded modules is becoming increasingly important. Therefore, on both of R&D verification phase and production phase, high quality testing is required and getting critical.
In addition to that, due to more complexity of the IoT modules, it is required faster market launch the devices to win the biz and SiP packaging technology is starting use on this segment.
 This presentation introduces the market trends, critical defect factors on SiP/module and Testing needs for these defects. It is explaining testing challenges of these testing needs with Advantest leading-edge test technologies.

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