Session 1.3 - Packaging and Test: WLCSP Advanced Inspection Challenges and Solutions

Wednesday, July 10
11:40am to 12:05pm

The continuous increase of product quality requirements in IoT, mobility and automotive markets, is driving the need for upstream detection of micro-crack defects on integrated circuits, not otherwise identifiable via electrical test.  This is a growing segment in semiconductor inspection as WLCSP content increases within advanced packaging.

Infra-Red (IR) imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional vision inspection systems.  

In this seminar, Cohu will describe its breakthrough solution by integrating IR imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection.

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